Product Features
- Ultra-low Na₂O content (<0.10%) ensures superior stability for semiconductor and electronic-grade polishing.
- High purity Al₂O₃ ≥ 99.6% provides strong hardness and extremely low impurities—preventing contamination or micro-scratches.
- Very narrow particle size distribution guarantees stable polishing rate and repeatable surface accuracy.
- Excellent chemical inertness and thermal stability, suitable for high-precision polishing applications.
- Available in micro-powder grades (W, F, P series) and customized ultra-fine sizes for CMP & optical polishing.
Application Fields
- Polishing of semiconductors, electronic components, silicon wafers
- Precision lapping of ceramics, sapphire substrates, and optical glass
- Surface finishing of aluminum parts, stainless steel, and high-end metal components
- Used in CMP slurries, high-purity polishing powders, and precision grinding pastes
- As a filler in high-grade refractory materials and anti-wear coatings
Low Sodium Content Specifications
| Grade | Na₂O Content | Al₂O₃ | Application |
|---|---|---|---|
| Low Sodium WFA – Standard | ≤ 0.25% | ≥ 99.5% | General polishing, abrasive tools |
| Low Sodium WFA – High Purity | ≤ 0.10% | ≥ 99.6% | Optical glass, ceramic lapping |
| Low Sodium WFA – Ultra Low | ≤ 0.05% | ≥ 99.7% | Semiconductor CMP, precision electronic polishing |
Technical Specifications
| Property | Value |
|---|---|
| Al₂O₃ Content | ≥ 99.6% |
| Fe₂O₃ | ≤ 0.03% |
| Na₂O (Low Sodium) | ≤ 0.10% (custom ≤ 0.05%) |
| Mohs Hardness | 9.0 |
| Particle Size Range | F240–F20000 / W3.5–W0.5 |
| Color | Pure White |
| Crystal Structure | Alpha-Alumina |
| Melting Point | 2050°C |
💬 Frequently Asked Questions
Q1: What is the difference between low sodium WFA and regular WFA?
Low sodium WFA has Na₂O ≤ 0.10%, making it more stable and suitable for electronic, semiconductor, and precision polishing applications where contamination must be minimized.
Q2: Why is low sodium content important?
Lower sodium reduces moisture absorption, improves thermal stability, and prevents chemical reactions in semiconductor processes.
Q3: Can low sodium WFA be used for optical polishing?
Yes, especially high-purity and ultra-low sodium grades. Their consistent particle size ensures scratch-free surface finishes.
Q4: What packaging options are available?
25 kg kraft bags or 1-ton jumbo bags. Vacuum-sealed moisture-proof packaging is available for semiconductor-grade materials.
xlabrasive@gmail.com –
We have been using Low Sodium WFA Micro Powder #8000 for precision polishing of stainless-steel components. The particle-size consistency is excellent, and the ultra-low Na₂O level clearly improves the finish stability compared with ordinary WFA powders we used before. The powder cuts cleanly without scratching and delivers a very smooth final surface. Quality is stable from batch to batch, and it works perfectly in our slurry system. Highly satisfied.