Low Sodium WFA Micro Powder #8000(Na20 ≤

powder is produced from high-purity alumina melted in an electric arcfurnace and processed into uniform micro-sized particles with ultra-low Na,O content. By reducing sodiumimpurities to <0.10% or even <0.05%, the powder offers greater chemical stability, lower hygroscopicity, andenhanced performance in sensitive polishing environments It maintains the same high hardness, sharp crystalline structure, and thermal resistance of standard white fusedalumina, but with improved consistency for semiconductor, electronic, and optical applications. The ultra-cleancomposition ensures minimal contamination, making it ideal for precision polishing, CMP formulations, opticalglass finishing, ceramic substrate lapping, and high-end metal surface treatment where purity and processstability are essential.
Product SKU: 1
Product Brand: XIN LI
Product Currency: USD
Product Price: 3
Price Valid Until: 2099-01-02
Product In-Stock: InStock
5
Product Features
- Ultra-low Na₂O content (<0.10%) ensures superior stability for semiconductor and electronic-grade polishing.
- High purity Al₂O₃ ≥ 99.6% provides strong hardness and extremely low impurities—preventing contamination or micro-scratches.
- Very narrow particle size distribution guarantees stable polishing rate and repeatable surface accuracy.
- Excellent chemical inertness and thermal stability, suitable for high-precision polishing applications.
- Available in micro-powder grades (W, F, P series) and customized ultra-fine sizes for CMP & optical polishing.
Application Fields
- Polishing of semiconductors, electronic components, silicon wafers
- Precision lapping of ceramics, sapphire substrates, and optical glass
- Surface finishing of aluminum parts, stainless steel, and high-end metal components
- Used in CMP slurries, high-purity polishing powders, and precision grinding pastes
- As a filler in high-grade refractory materials and anti-wear coatings
Low Sodium Content Specifications
| Grade | Na₂O Content | Al₂O₃ | Application |
|---|---|---|---|
| Low Sodium WFA – Standard | ≤ 0.25% | ≥ 99.5% | General polishing, abrasive tools |
| Low Sodium WFA – High Purity | ≤ 0.10% | ≥ 99.6% | Optical glass, ceramic lapping |
| Low Sodium WFA – Ultra Low | ≤ 0.05% | ≥ 99.7% | Semiconductor CMP, precision electronic polishing |
Technical Specifications
| Property | Value |
|---|---|
| Al₂O₃ Content | ≥ 99.6% |
| Fe₂O₃ | ≤ 0.03% |
| Na₂O (Low Sodium) | ≤ 0.10% (custom ≤ 0.05%) |
| Mohs Hardness | 9.0 |
| Particle Size Range | F240–F20000 / W3.5–W0.5 |
| Color | Pure White |
| Crystal Structure | Alpha-Alumina |
| Melting Point | 2050°C |
💬 Frequently Asked Questions
Q1: What is the difference between low sodium WFA and regular WFA?
Low sodium WFA has Na₂O ≤ 0.10%, making it more stable and suitable for electronic, semiconductor, and precision polishing applications where contamination must be minimized.
Q2: Why is low sodium content important?
Q3: Can low sodium WFA be used for optical polishing?
Q4: What packaging options are available?
Low Sodium WFA Micro Powder #8000(Na20 ≤

powder is produced from high-purity alumina melted in an electric arcfurnace and processed into uniform micro-sized particles with ultra-low Na,O content. By reducing sodiumimpurities to <0.10% or even <0.05%, the powder offers greater chemical stability, lower hygroscopicity, andenhanced performance in sensitive polishing environments It maintains the same high hardness, sharp crystalline structure, and thermal resistance of standard white fusedalumina, but with improved consistency for semiconductor, electronic, and optical applications. The ultra-cleancomposition ensures minimal contamination, making it ideal for precision polishing, CMP formulations, opticalglass finishing, ceramic substrate lapping, and high-end metal surface treatment where purity and processstability are essential.
Product SKU: 1
Product Brand: XIN LI
Product Currency: USD
Product Price: 3
Price Valid Until: 2099-01-02
Product In-Stock: InStock
5
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xlabrasive@gmail.com –
We have been using Low Sodium WFA Micro Powder #8000 for precision polishing of stainless-steel components. The particle-size consistency is excellent, and the ultra-low Na₂O level clearly improves the finish stability compared with ordinary WFA powders we used before. The powder cuts cleanly without scratching and delivers a very smooth final surface. Quality is stable from batch to batch, and it works perfectly in our slurry system. Highly satisfied.